News

Windgo wins patent for smart damping adhesive

October 17, 2018

Windgo Inc. recently won US Patent No. 10,088,011 for a substrate-backed smart damping adhesive. This technology can help sense and report substrate and adhesive changes caused by a change in temperature, pressure, sound waves, electromagnetic waves or seismic waves, according to a press release.

Windgo's system has a variety of uses such as noise cancelling and production of digital signage, robot skin and smart building materials. The company's SDA tape can help deflect or absorb a physical shock received by a substrate, according to the release.

"Stacked adhesive layers may be configured to form a multi-purpose SDA tape solution," the release noted.